Invention Grant
- Patent Title: Metal powder for powder metallurgy, compound, granulated powder, and sintered body
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Application No.: US16295477Application Date: 2019-03-07
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Publication No.: US11332811B2Publication Date: 2022-05-17
- Inventor: Hidefumi Nakamura , Ryo Numasawa
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2018-042268 20180308
- Main IPC: C22C33/02
- IPC: C22C33/02 ; B22F1/00 ; B22F3/10 ; C22C38/02 ; C22C38/04 ; C22C38/44 ; C22C38/48 ; B22F1/10

Abstract:
A metal powder for powder metallurgy contains Fe as a principal component, Cr in a proportion of 11.0 mass % or more and 25.0 mass % or less, Ni in a proportion of 8.0 mass % or more and 30.0 mass % or less, Si in a proportion of 0.20 mass % or more and 1.2 mass % or less, C in a proportion of 0.070 mass % or more and 0.40 mass % or less, Mn in a proportion of 0.10 mass % or more and 2.0 mass % or less, P in a proportion of 0.10 mass % or more and 0.50 mass % or less, and at least one of W and Nb in a proportion of 0.20 mass % or more and 3.0 mass % or less in total.
Public/Granted literature
- US20200024704A1 Metal Powder For Powder Metallurgy, Compound, Granulated Powder, And Sintered Body Public/Granted day:2020-01-23
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