A cooling system for a light emitting diode assembly includes a heat exchanger configured to exchange heat from a fluid to ambient air, an enclosure configured to house the LED assembly, and a pump configured to circulate the fluid through the enclosure, through the LED assembly, or both, and through the heat exchanger. The fluid is configured to absorb heat at the LED assembly and generated by the LED assembly, and the heat exchanger is configured to cool the fluid and remove the heat absorbed by the fluid at the LED assembly.