- Patent Title: Heat insulating structure for cooling device, and cooling device
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Application No.: US17103868Application Date: 2020-11-24
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Publication No.: US11333428B2Publication Date: 2022-05-17
- Inventor: Masato Yukishita , Tadashi Okada
- Applicant: PHC HOLDINGS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: PHC HOLDINGS CORPORATION
- Current Assignee: PHC HOLDINGS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JPJP2018-100878 20180525
- Main IPC: F25D23/06
- IPC: F25D23/06 ; F25D23/08 ; F25D23/02

Abstract:
The invention is provided with a housing which has an inner space open in a first direction, a partition body which divides the inlet of the inner space into a plurality of openings arranged next to each other in a second direction perpendicular to the first direction, a door which is provided to each of the openings and which closes the opening from the first direction side, a first vacuum heat insulating material which is disposed inside the partition body, and a second vacuum heat insulating material which is disposed inside the door. The first vacuum heat insulating material and the second vacuum heat insulating material are arranged so as to overlap each other when viewed from the first direction side or from the second direction side.
Public/Granted literature
- US20210080168A1 HEAT INSULATING STRUCTURE FOR COOLING DEVICE, AND COOLING DEVICE Public/Granted day:2021-03-18
Information query
IPC分类: