Invention Grant
- Patent Title: Non-directional in-line suspended PCB power sensing coupler
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Application No.: US16658467Application Date: 2019-10-21
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Publication No.: US11333686B2Publication Date: 2022-05-17
- Inventor: Jefferson D. Lexa
- Applicant: Tegam, Inc.
- Applicant Address: US OH Geneva
- Assignee: Tegam, Inc.
- Current Assignee: Tegam, Inc.
- Current Assignee Address: US OH Geneva
- Agency: Brennan, Manna & Diamond, LLC
- Main IPC: G01R15/18
- IPC: G01R15/18 ; H05K5/00 ; H05K1/02 ; G01R21/06 ; H05K1/18

Abstract:
An in-line suspended non-directional power sensor coupling configuration situated within a high frequency transmission line housing that allows non-directional current and sampling voltage elements to all be produced simultaneously on one or more double sided printed circuit boards (PCB). The power sensor coupling allows for repeatable calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.
Public/Granted literature
- US20210116479A1 Non-Directional In-Line Suspended PCB Power Sensing Coupler Public/Granted day:2021-04-22
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