Invention Grant
- Patent Title: Inspection apparatus of semiconductor device and method for inspecting semiconductor device
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Application No.: US16799980Application Date: 2020-02-25
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Publication No.: US11333700B2Publication Date: 2022-05-17
- Inventor: Jumpei Tajima , Jongil Hwang , Shinya Nunoue
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Minato-ku; JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee: KABUSHIKI KAISHA TOSHIBA,TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Current Assignee Address: JP Minato-ku; JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JPJP2019-084288 20190425
- Main IPC: G01R31/26
- IPC: G01R31/26

Abstract:
According to one embodiment, an inspection apparatus of a semiconductor device includes a first probe configured to contact a first portion of the semiconductor device, a conductive member configured to oppose a second portion of the semiconductor device, and a detector configured to apply a first voltage between the semiconductor device and the first probe, to apply a conductive member voltage between the semiconductor device and the conductive member, and to detect a current flowing in the first probe. The first voltage has a first polarity of one of positive or negative when referenced to a potential of the semiconductor device. The conductive member voltage has a second polarity of the other of positive or negative when referenced to the potential of the semiconductor device.
Public/Granted literature
- US20200341048A1 INSPECTION APPARATUS OF SEMICONDUCTOR DEVICE AND METHOD FOR INSPECTING SEMICONDUCTOR DEVICE Public/Granted day:2020-10-29
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