The invention relates to a sliding test device for electronic components, which mainly comprises a base, a sliding frame and a pressing member, wherein an electronic component to be tested is placed in a chip receiving module of the base, and the sliding frame is slidably moved with respect to the base under sliding engagement between a first sliding guide and a second sliding guide so that a pressing block of the pressing member is aligned with the electronic component presses the electronic component. According to the present invention, the pressing member presses the electronic component and exerts a sufficient contact force on the electronic component, and a reaction force caused by the contact force and the elastic restoring force of probes is internally balanced in the device.