Invention Grant
- Patent Title: Resin, photosensitive resin composition, electronic component and display device using the same
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Application No.: US15545912Application Date: 2016-01-25
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Publication No.: US11333976B2Publication Date: 2022-05-17
- Inventor: Tomoyuki Yuba , Yuki Masuda , Jiake Jin , Ping Li
- Applicant: TORAY INDUSTRIES, INC.
- Applicant Address: JP Tokyo
- Assignee: TORAY INDUSTRIES, INC.
- Current Assignee: TORAY INDUSTRIES, INC.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2015-012924 20150127,CN201510134502.8 20150326,CN201510134581.2 20150326
- International Application: PCT/JP2016/052016 WO 20160125
- International Announcement: WO2016/121691 WO 20160804
- Main IPC: G03F7/023
- IPC: G03F7/023 ; G03F7/40 ; C08G69/32 ; C07C209/74 ; C07C231/02 ; C07D209/48 ; C07D263/62 ; C07C231/12 ; H01L21/027 ; C07C41/22 ; H01L23/31 ; H05K3/34 ; C07C213/00 ; C07C211/56 ; C08G73/10 ; G03F7/037 ; C09D179/08 ; C07C67/307 ; C07C269/06 ; C09D179/04 ; G03F7/039 ; C07C25/18 ; C07C215/80 ; C07D263/56 ; C08G73/22 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; H01L23/29 ; H01L27/12 ; H05K1/02 ; H01L27/32
Abstract:
A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):
Public/Granted literature
- US20180011402A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME Public/Granted day:2018-01-11
Information query
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