Invention Grant
- Patent Title: Ceramic electronic component
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Application No.: US16197340Application Date: 2018-11-20
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Publication No.: US11335506B2Publication Date: 2022-05-17
- Inventor: Dong Yeong Kim , Dong Hwi Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0118954 20181005
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/008 ; H01G4/232

Abstract:
A ceramic electronic component includes a body including a capacitance formation portion including a dielectric layer and a plurality of internal electrodes disposed to face each other with the dielectric layer interposed therebetween and forming capacitance and protective portions disposed on upper and lower surfaces of the capacitance formation portion and external electrodes including electrode layers disposed on the body and connected to the plurality of internal electrodes and conductive resin layers respectively disposed on the electrode layers, wherein ta2/ta1 is 0.05 or greater, where ta1 is the thickness of the electrode layer at a central portion of the capacitance formation portion and ta2 is the thickness of the electrode layer at a boundary between the capacitance formation portion and the protective portion.
Information query