The disclosure provides a mass transfer method and device for micro light emitting diode chips. The method includes the following steps: performing magnetic pole electroplating on the micro light emitting diode chips obtained by peeling off the sapphire substrate to enable corresponding magnetic poles to be generated at corresponding positions of the micro light emitting diode chips; peeling off the transfer substrate, and placing the micro light emitting diode chips obtained by peeling off the transfer substrate in a dispersion liquid to form a solution in which micro light emitting diode chips are dispersed; and the display substrate picks up the micro light emitting diode chips dispersed under the action of the magnetic field force.