Invention Grant
- Patent Title: Wire bonding structure
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Application No.: US16970911Application Date: 2019-02-25
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Publication No.: US11335661B2Publication Date: 2022-05-17
- Inventor: Miwa Muto , Hideaki Matsuzaki
- Applicant: Nippon Telegraph and Telephone Corporation
- Applicant Address: JP Tokyo
- Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee: Nippon Telegraph and Telephone Corporation
- Current Assignee Address: JP Tokyo
- Agency: Slater Matsil, LLP
- Priority: JPJP2018-054040 20180322
- International Application: PCT/JP2019/006961 WO 20190225
- International Announcement: WO2019/181373 WO 20190926
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/065 ; H01L25/00

Abstract:
A first signal electrode and a second signal electrode are connected by a first wire, a first ground electrode and a fourth ground electrode are connected by a second wire, and a second ground electrode and a third ground electrode are connected by a third wire. The second wire and the third wire cross at only one position above the first wire.
Information query
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