Invention Grant
- Patent Title: Quantum dot solid-state film and method for preparing same, and quantum dot light-emitting diode
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Application No.: US16493606Application Date: 2018-03-13
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Publication No.: US11335873B2Publication Date: 2022-05-17
- Inventor: Luling Cheng , Yixing Yang
- Applicant: TCL TECHNOLOGY GROUP CORPORATION
- Applicant Address: CN Huizhou
- Assignee: TCL TECHNOLOGY GROUP CORPORATION
- Current Assignee: TCL TECHNOLOGY GROUP CORPORATION
- Current Assignee Address: CN Huizhou
- Agency: Anova Law Group, PLLC
- Priority: CN201710154738.7 20170315
- International Application: PCT/CN2018/078777 WO 20180313
- International Announcement: WO2018/166428 WO 20180920
- Main IPC: H01L51/50
- IPC: H01L51/50 ; H01L51/00 ; H01L51/52 ; H01L51/56 ; B82Y30/00 ; B82Y40/00

Abstract:
Disclosed are quantum dot solid-state film, method for preparing same, and quantum dot light-emitting diode. Method comprises: providing quantum dot solution, preparing quantum dot material solid-state film on substrate; before being immersed in surface modifier solution to obtain quantum dot material solid-state film modified by a surface modifier; providing a metal nanoparticle seed solution, using solution method to deposit nanoparticle on quantum dot material solid-state film modified by surface modifier to obtain a quantum dot material solid-state film with the surface having adsorbed a layer of metal nanoparticle seed; before being immersed in a metal nano wire precursor solution, nanoparticle to perform a metal nano wire growth, finally obtaining a quantum dot solid-state film. The quantum dot solid-state film obtained using method of invention can effectively and rapidly transmit electrical charges, improving overall performance of device.
Information query
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