Invention Grant
- Patent Title: High-frequency module and communication apparatus
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Application No.: US16161117Application Date: 2018-10-16
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Publication No.: US11336238B2Publication Date: 2022-05-17
- Inventor: Hideki Muto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JP2016-155022 20160805,JP2017-109028 20170601
- Main IPC: H03F3/195
- IPC: H03F3/195 ; H03H7/46 ; H03F1/56

Abstract:
A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively provided among the plurality of paths connect the respective filters and the switch without connecting impedance elements, and each of the first and second filters has an output impedance located in a matching region between a NF matching impedance at which an NF of the low noise amplifier is minimum and a gain matching impedance at which a gain of the low noise amplifier is maximum in its respective pass band thereof on a Smith chart.
Public/Granted literature
- US20190052241A1 HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS Public/Granted day:2019-02-14
Information query
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