Invention Grant
- Patent Title: Stretchable wiring board and method for manufacturing stretchable wiring board
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Application No.: US16979248Application Date: 2019-03-19
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Publication No.: US11337304B2Publication Date: 2022-05-17
- Inventor: Kazutoshi Koshimizu
- Applicant: Fujikura Ltd.
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2018-050527 20180319,JPJP2018-050529 20180319
- International Application: PCT/JP2019/011425 WO 20190319
- International Announcement: WO2019/181931 WO 20190926
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K3/28

Abstract:
A stretchable wiring board includes: a first stretchable substrate; an overcoat layer; and a conductor layer interposed at least partly between the first stretchable substrate and the overcoat layer. The conductor layer includes a wiring portion covered with the overcoat layer and a connection portion that has a surface exposed from the overcoat layer. The exposed surface of the connection portion is flush with a top surface of the overcoat layer.
Public/Granted literature
- US20210059046A1 STRETCHABLE WIRING BOARD AND METHOD FOR MANUFACTURING STRETCHABLE WIRING BOARD Public/Granted day:2021-02-25
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