Invention Grant
- Patent Title: Methods and systems for electroadhesion-based manipulation in manufacturing
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Application No.: US16030340Application Date: 2018-07-09
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Publication No.: US11338449B2Publication Date: 2022-05-24
- Inventor: Harsha Prahlad , Richard J. Casler , Susan Kim , Matthew Leettola , Jon Smith , Kenneth Tan , Patrick Wang , John Mathew Farren , Patrick Conall Regan , Po Cheng Chen , Howard Fu , Dragan Jurkovic , Aishwarya Varadhan , Chang-Chu Liao , Chih-Chi Chang , Kuo-Hung Lee , Ming-Feng Jean
- Applicant: GRABIT, INC.
- Applicant Address: US CA Sunnyvale
- Assignee: GRABIT, INC.
- Current Assignee: GRABIT, INC.
- Current Assignee Address: US CA Sunnyvale
- Agency: Gardner, Linn, Burkhart & Ondersma LLP
- Main IPC: B25J15/00
- IPC: B25J15/00 ; B25J9/00 ; B25J19/02 ; B25J15/06 ; B25J9/16 ; B23P19/00 ; B32B37/18 ; B25H1/20 ; H02N13/00 ; B23P21/00 ; B32B38/18 ; A43D111/00
Abstract:
Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.
Public/Granted literature
- US20180326596A1 METHODS AND SYSTEMS FOR ELECTROADHESION-BASED MANIPULATION IN MANUFACTURING Public/Granted day:2018-11-15
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