A fabrication system is operable to form a structure (such as on a substrate) using a combination of a first (electrically) non-conductive material and a second (electrically) non-conductive. In one embodiment, the structure defined by the first material and the second material defines a void (passageway) in the structure. In one embodiment, exposed surfaces of the first non-conductive material and the second non-conductive material define the void in the structure. Subsequent to creating the structure including the void, the fabrication system fills the void (such as via injection) with an electrically conductive material. After the injected electrically conductive material (such as metal epoxy or other suitable material) solidifies, the fabrication system removes the first non-conductive material (sacrificial material) from the structure. The remaining second material provides structural support for the electrically conductive material.