Invention Grant
- Patent Title: Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate
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Application No.: US16393057Application Date: 2019-04-24
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Publication No.: US11338774B2Publication Date: 2022-05-24
- Inventor: Hirotoshi Suetsugu , Manabu Hirakawa , Satoshi Goishihara , Koichi Kinoshita , Hidenori Nakamura , Koujiro Ohkawa , Tetsuo Matsukura , Isao Inoue
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr & Brown, PLLC
- Priority: JP2014-232932 20141117,JP2014-232953 20141117,JP2014-243419 20141201,JP2015-002578 20150108,JP2015-015844 20150129
- Main IPC: B60S1/02
- IPC: B60S1/02 ; B60S1/58 ; H01C17/00 ; H05B3/84

Abstract:
A heating plate includes: a pair of glass plates; a conductive pattern disposed between the pair of glass plates and defining a plurality of opening areas; and a joint layer disposed between the conductive pattern and at least one of the pair of glass plates; wherein the conductive pattern includes a plurality of connection elements that extend between two branch points to define the opening areas; and a rate of the connection elements, which are straight line segments connecting the two branch points, relative to the plurality of connection elements, is less than 20%.
Public/Granted literature
- US11299128B2 Heating plate, conductive pattern sheet, vehicle, and method of manufacturing heating plate Public/Granted day:2022-04-12
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