Invention Grant
- Patent Title: Low stress packaging design to minimize pellet blocking
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Application No.: US16325570Application Date: 2017-08-08
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Publication No.: US11338974B2Publication Date: 2022-05-24
- Inventor: Shrikant Dhodapkar , Rocklyn P. Gravouilla , William B. Bellefontaine , Fernanda Bortolane Bueno
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Quarles & Brady LLP
- International Application: PCT/US2017/045902 WO 20170808
- International Announcement: WO2018/034887 WO 20180222
- Main IPC: B65D71/00
- IPC: B65D71/00 ; B65D19/38

Abstract:
Packaging configuration comprising: a pallet comprising a top surface, a bottom surface and a height HP; a first stack of bagged goods having a total height HL1, stacked on the pallet and comprising at least two layers; and a support structure comprising at least four walls situated over the first stack of bagged goods, one of the walls being a top wall and at least three of the walls being sidewalls. The support structure has a height HC that meets one of the following equations: HC>HL1, when the bottom end of at least one sidewall of the support structure is positioned on the top surface of the at least one pallet; or HC>HP+HL1, when the bottom end of at least one sidewall of the support structure and the bottom surface of the pallet are both positioned on the same surface. An air gap having a height HAG is situated between a top layer of the first stack of bagged goods and the top wall of the support structure.
Public/Granted literature
- US20210284412A1 Low Stress Packaging Design to Minimize Pellet Blocking Public/Granted day:2021-09-16
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