Invention Grant
- Patent Title: Dual cure composition
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Application No.: US17605015Application Date: 2020-08-03
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Publication No.: US11339256B1Publication Date: 2022-05-24
- Inventor: Junying Liu , David M. Altergott , Steven Swier
- Applicant: Dow Silicones Corporation
- Applicant Address: US MI Midland
- Assignee: Dow Silicones Corporation
- Current Assignee: Dow Silicones Corporation
- Current Assignee Address: US MI Midland
- Agent Steven W. Mork
- International Application: PCT/US2020/044708 WO 20200803
- International Announcement: WO2021/026054 WO 20210211
- Main IPC: C08G77/18
- IPC: C08G77/18 ; C08J3/24 ; C08L83/04 ; C08K5/37 ; C08K5/5419 ; C08G77/20 ; C08G77/00 ; C08G77/08

Abstract:
A composition contains (a) a silicon-free mercapto compound comprising 2 or more mercapto groups; (b) a linear polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group, 40 mole-percent or more phenyl groups relative to moles of silicon atoms and at least one alkoxysilyl group per molecule; (c) a resinous polyorganosiloxane containing one or more than one terminally unsaturated alkenyl group and 20 mole-percent or more phenyl groups relative to moles of silicon atoms; (d) a photoinitiator; and (e) a moisture cure catalyst; and wherein the molar ratio of mercapto groups to terminally unsaturated alkenyl groups in the composition is in a range of 0.3 to 2.0.
Public/Granted literature
- US20220145020A1 DUAL CURE COMPOSITION Public/Granted day:2022-05-12
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