Invention Grant
- Patent Title: Systems and methods of controlling electroplating
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Application No.: US17176660Application Date: 2021-02-16
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Publication No.: US11339493B2Publication Date: 2022-05-24
- Inventor: Peiyan Cao , Yurun Liu
- Applicant: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: IPro, PLLC
- Agent Qian Gu
- Main IPC: G01N23/223
- IPC: G01N23/223 ; C25D5/00

Abstract:
Disclosed herein is a system, comprising: a detector configured to determine a number of photons of one or more characteristic X-rays emitted by a chemical element in the electrolyte and received by the detector, within a period of time; a processor configured to determine a concentration of the chemical element in the electrolyte based on the number; a controller configured to replenish the chemical element into the electrolyte or configured to stop electroplating with the electrolyte, based on the concentration.
Public/Granted literature
- US20210164121A1 SYSTEMS AND METHODS OF CONTROLLING ELECTROPLATING Public/Granted day:2021-06-03
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