Invention Grant
- Patent Title: Systems and methods for bonding a downhole tool to a surface within the borehole
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Application No.: US16878604Application Date: 2020-05-20
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Publication No.: US11339621B2Publication Date: 2022-05-24
- Inventor: William Cecil Pearl, Jr. , Sam Lewis
- Applicant: Halliburton Energy Services, Inc.
- Applicant Address: US TX Houston
- Assignee: Halliburton Energy Services, Inc.
- Current Assignee: Halliburton Energy Services, Inc.
- Current Assignee Address: US TX Houston
- Agency: K&L Gates LLP
- Main IPC: E21B23/06
- IPC: E21B23/06 ; E21B33/12 ; B23K3/06 ; B23K1/00

Abstract:
An assembly for use in a downhole tool. The assembly may include a body that includes a chamber with a solder suspension contained therein, the solder suspension comprising solder particles, each solder particle comprising an outer shell and a liquid metal core that is exposed and solidifies upon rupture of the outer shell. The assembly may also include a port that allows fluid flow between the chamber and an area outside of the chamber. The assembly may further include a plunger actuatable to apply a force to create a pressure to the solder suspension within the chamber to eject the solder suspension from the port at a velocity to rupture the outer shells of the particles upon contact with a surface.
Public/Granted literature
- US20210363845A1 Systems and Methods for Bonding a Downhole Tool to a Surface within the Borehole Public/Granted day:2021-11-25
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