Invention Grant
- Patent Title: Automatic recipe optimization for overlay metrology system
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Application No.: US16919378Application Date: 2020-07-02
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Publication No.: US11340060B2Publication Date: 2022-05-24
- Inventor: Weihua Li , Shiming Wei
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B11/24
- IPC: G01B11/24 ; G06N3/04

Abstract:
An overlay metrology system is disclosed. The overlay metrology system includes a controller configured to be communicatively coupled with an overlay metrology subsystem. The controller receives overlay measurements from the overlay metrology subsystem and generates one or more quality metrics. The controller extracts a set of principle components from the one or more quality metrics. The controller generates input data and inputs the input data into an input matrix of a supervised machine learning algorithm to train a predictive model. The controller then identifies a recipe or hardware configuration with a minimum residual value.
Public/Granted literature
- US20210025695A1 Automatic Recipe Optimization for Overlay Metrology System Public/Granted day:2021-01-28
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