Invention Grant
- Patent Title: Method and apparatus for detecting facet region, wafer producing method, and laser processing apparatus
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Application No.: US16675798Application Date: 2019-11-06
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Publication No.: US11340163B2Publication Date: 2022-05-24
- Inventor: Yusaku Ito , Naoki Murazawa , Kazuya Hirata
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JPJP2018-210679 20181108
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01N21/64
Abstract:
A method of detecting a Facet region includes: a fluorescence luminance detecting step of detecting fluorescence luminance unique to SiC by irradiating a SiC ingot with exciting light having a predetermined wavelength from a top surface of the SiC ingot; and a coordinate setting step of setting a region in which the fluorescence luminance is equal to or higher than a predetermined value in the fluorescence luminance detecting step as a non-Facet region, setting a region in which the fluorescence luminance is lower than the predetermined value in the fluorescence luminance detecting step as a Facet region, and setting coordinates of a boundary between the Facet region and the non-Facet region.
Public/Granted literature
- US20200150038A1 METHOD AND APPARATUS FOR DETECTING FACET REGION, WAFER PRODUCING METHOD, AND LASER PROCESSING APPARATUS Public/Granted day:2020-05-14
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