Invention Grant
- Patent Title: Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
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Application No.: US16926757Application Date: 2020-07-12
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Publication No.: US11340284B2Publication Date: 2022-05-24
- Inventor: Kristiaan Van Rossen , Christophe Wouters
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/265 ; H01L21/66 ; H01L21/67

Abstract:
A first light source is directed at an outer surface of a workpiece in an inspection module. The light from the first light source that is reflected from the outer surface of the workpiece is directed to the camera via a first pathway. The light from the first light source transmitted through the workpiece is directed to the camera via a second pathway. A second light source is directed at the outer surface of the workpiece 180° from that of the first light source. The light from the second light source that is reflected from the outer surface of the workpiece is directed to the camera via the second pathway. The light from the second light source transmitted through the workpiece is directed to the camera via the first pathway.
Public/Granted literature
- US20210025934A1 Combined Transmitted and Reflected Light Imaging of Internal Cracks in Semiconductor Devices Public/Granted day:2021-01-28
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