Invention Grant
- Patent Title: Thermal mitigation in devices with multiple processing units
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Application No.: US16674494Application Date: 2019-11-05
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Publication No.: US11340689B2Publication Date: 2022-05-24
- Inventor: Nikesh Gupta , Harshit Tiwari , Ashish Bajaj , Maheshwar Thakur Singh
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: G06F1/3287
- IPC: G06F1/3287 ; G06F1/3296 ; H04W52/02 ; G06F1/3234 ; G06F1/20 ; G06F1/3206

Abstract:
A method of thermal mitigation in a device having a plurality of non-real-time processing units (PUs) and a plurality of real-time PUs, including connecting each of the plurality of real-time PUs and the plurality of non-real-time PUs to a first power supply, and performing thermal mitigation. Performing thermal mitigation includes disconnecting each of the plurality of non-real-time PUs except one of the plurality of non-real-time PUs from the first power supply resulting in an active non-real-time PU, and connecting a second power supply that derives power from the first power supply to the active non-real-time PU, wherein a voltage supplied by the second power supply is less than a voltage supplied by the first power supply.
Public/Granted literature
- US20200073468A1 Thermal Mitigation in Devices with Multiple Processing Units Public/Granted day:2020-03-05
Information query
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