Invention Grant
- Patent Title: Biased sampling methodology for wear leveling
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Application No.: US16921479Application Date: 2020-07-06
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Publication No.: US11341036B2Publication Date: 2022-05-24
- Inventor: Ying Yu Tai , Jiangli Zhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Lowenstein Sandler LLP
- Main IPC: G06F12/02
- IPC: G06F12/02 ; G06F12/06

Abstract:
A system includes a memory device and a processing device, coupled to the memory device. The processing device is to sample a first subset of data units from a set of data units of the memory device using a biased sampling process that increases a probability of sampling particular data units from the set of data units based on one or more characteristics associated with the particular data units. The processing device is to identify a first candidate data unit from the first subset of data units and perform a wear leveling operation in view of the first candidate data unit.
Public/Granted literature
- US20200334137A1 BIASED SAMPLING METHODOLOGY FOR WEAR LEVELING Public/Granted day:2020-10-22
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