Invention Grant
- Patent Title: Manufacturing metal inlays for dual interface metal cards
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Application No.: US16807176Application Date: 2020-03-03
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Publication No.: US11341389B2Publication Date: 2022-05-24
- Inventor: Mustafa Lotya , David Finn , Darren Molloy
- Applicant: AmaTech Group Limited
- Applicant Address: IE Spiddal
- Assignee: AmaTech Group Limited
- Current Assignee: AmaTech Group Limited
- Current Assignee Address: IE Spiddal
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: G06K19/02
- IPC: G06K19/02 ; G06K19/077 ; H01Q1/22

Abstract:
A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.
Public/Granted literature
- US20200250504A1 MANUFACTURING METAL INLAYS FOR DUAL INTERFACE METAL CARDS Public/Granted day:2020-08-06
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