Invention Grant
- Patent Title: Chip electronic component
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Application No.: US16011886Application Date: 2018-06-19
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Publication No.: US11342107B2Publication Date: 2022-05-24
- Inventor: Kwang Sun Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0179517 20171226
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/36 ; H01F27/255 ; H01F27/28 ; H01F17/04 ; H01F17/00 ; H01F3/10
Abstract:
A chip electronic component includes a magnetic body including first magnetic metal particles, internal coil portions embedded within the magnetic body, and insulation resistance layers disposed on upper and lower surfaces of the magnetic body and including second magnetic metal particles having an oxide coating.
Public/Granted literature
- US20190198221A1 CHIP ELECTRONIC COMPONENT Public/Granted day:2019-06-27
Information query
