Invention Grant
- Patent Title: Multilayer capacitor having external electrode including conductive resin layer
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Application No.: US17030943Application Date: 2020-09-24
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Publication No.: US11342119B2Publication Date: 2022-05-24
- Inventor: Jung Min Kim , Bon Seok Koo , Jung Wook Seo , Yoon Hee Lee , Kun Hoi Koo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0046323 20160415,KR10-2016-0176098 20161221
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30

Abstract:
A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
Public/Granted literature
- US20210005388A1 MULTILAYER CAPACITOR HAVING EXTERNAL ELECTRODE INCLUDING CONDUCTIVE RESIN LAYER Public/Granted day:2021-01-07
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