An integrated circuit structure may be formed having a substrate, at least one integrated circuit device embedded in and electrically attached to the substrate, and a heat transfer fluid conduit extending through the substrate. In one embodiment, the heat transfer fluid conduit may be lined with a metallization within the substrate. In a further embodiment, the heat transfer fluid conduit may comprise multiple fluid channels for the removal of heat from multiple surfaces of the at least one integrated circuit device. In still a further embodiment, the substrate may include a molded layer, wherein at least one fluid channel is formed in the molded layer.