Invention Grant
- Patent Title: Electronic components for soft, flexible circuitry layers and methods therefor
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Application No.: US16657239Application Date: 2019-10-18
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Publication No.: US11342271B2Publication Date: 2022-05-24
- Inventor: Madison Thea Maxey , Ezgi Uçar , Janett Martinez
- Applicant: LOOMIA Technologies, Inc.
- Applicant Address: US NY New York
- Assignee: LOOMIA Technologies, Inc.
- Current Assignee: LOOMIA Technologies, Inc.
- Current Assignee Address: US NY New York
- Agency: Bookoff McAndrews, PLLC
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/50 ; H01R12/77 ; H01L33/62
Abstract:
A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
Public/Granted literature
- US20200051919A1 ELECTRONIC COMPONENTS FOR SOFT, FLEXIBLE CIRCUITRY LAYERS AND METHODS THEREFOR Public/Granted day:2020-02-13
Information query
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