Invention Grant
- Patent Title: Bonding with pre-deoxide process and apparatus for performing the same
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Application No.: US16264957Application Date: 2019-02-01
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Publication No.: US11342302B2Publication Date: 2022-05-24
- Inventor: Chen-Hua Yu , Ying-Jui Huang , Chih-Hang Tung , Tung-Liang Shao , Ching-Hua Hsieh , Chien Ling Hwang , Yi-Li Hsiao , Su-Chun Yang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L25/00 ; H01L21/683
Abstract:
A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
Public/Granted literature
- US20190326251A1 Bonding with Pre-Deoxide Process and Apparatus for Performing the Same Public/Granted day:2019-10-24
Information query
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