Invention Grant
- Patent Title: Image sensor device with reflective layer
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Application No.: US16924538Application Date: 2020-07-09
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Publication No.: US11342372B2Publication Date: 2022-05-24
- Inventor: Chun-Chieh Fang , Ming-Chi Wu , Ji-Heng Jiang , Chi-Yuan Wen , Chien-Nan Tu , Yu-Lung Yeh , Shih-Shiung Chen , Kun-Yu Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L31/0232
- IPC: H01L31/0232 ; H01L27/146

Abstract:
An image sensor device is provided. The image sensor device includes a semiconductor substrate having a first side, a second side opposite to the first side, and at least one light-sensing region close to the first side. The image sensor device includes a dielectric feature covering the second side and extending into the semiconductor substrate. The dielectric feature in the semiconductor substrate surrounds the light-sensing region. The image sensor device includes a reflective layer in the dielectric feature in the semiconductor substrate, wherein a top portion of the reflective layer protrudes away from the second side, and a top surface of the reflective layer and a top surface of the insulating layer are substantially coplanar.
Public/Granted literature
- US20200343289A1 IMAGE SENSOR DEVICE WITH REFLECTIVE LAYER Public/Granted day:2020-10-29
Information query
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