Invention Grant
- Patent Title: Sapphire collector for reducing mechanical damage during die level laser lift-off
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Application No.: US15573828Application Date: 2016-05-13
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Publication No.: US11342478B2Publication Date: 2022-05-24
- Inventor: Dong Nie , Kian Hock Tee
- Applicant: Lumileds LLC
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Volpe Koenig
- International Application: PCT/EP2016/060458 WO 20160513
- International Announcement: WO2016/180831 WO 20161117
- Main IPC: H01L33/00
- IPC: H01L33/00 ; B23K26/00 ; B23K26/70 ; H01L21/78 ; B23K26/142 ; H01L21/683 ; B23K26/57

Abstract:
In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure.
Public/Granted literature
- US20180261715A1 SAPPHIRE COLLECTOR FOR REDUCING MECHANICAL DAMAGE DURING DIE LEVEL LASER LIFT-OFF Public/Granted day:2018-09-13
Information query
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