Invention Grant
- Patent Title: Apparatus and method for bending
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Application No.: US16360292Application Date: 2019-03-21
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Publication No.: US11342822B2Publication Date: 2022-05-24
- Inventor: Keita Miyashita , Kazuaki Ushiku , Shinsuke Onishi , Hideki Shigematsu , Takumi Fukaura
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: HONDA MOTOR CO., LTD.
- Current Assignee: HONDA MOTOR CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JPJP2018-058245 20180326
- Main IPC: H02K15/04
- IPC: H02K15/04 ; H02K3/12 ; B21D7/04

Abstract:
A bending apparatus (10) includes an upper first die (11), an upper second die (12), a lower die (13), a control unit (20), an upper first moving mechanism (21), an upper second moving mechanism (22), a lower moving mechanism (23), a holding die (31), and a moving and rotating mechanism (32). The lower die (13) is moved in an upper direction after the upper first die (11) and the upper second die (12) are moved to the front, whereby four coil segments (4) are bent. When the upper second die (12) is moved to a first withdrawal position in the rear direction after the four coil segments (4) are bent, a working space for the holding die (31) is ensured.
Public/Granted literature
- US20190296620A1 APPARATUS AND METHOD FOR BENDING Public/Granted day:2019-09-26
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