Invention Grant
- Patent Title: Substrate processing machine
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Application No.: US16496705Application Date: 2017-03-30
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Publication No.: US11343951B2Publication Date: 2022-05-24
- Inventor: Mitsuru Sanji , Shingo Fujimura
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2017/013181 WO 20170330
- International Announcement: WO2018/179200 WO 20181004
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/08 ; H05K13/04

Abstract:
The object is to provide a substrate processing machine facilitating checking the operation of a device in the interior of a housing from the exterior of the housing. The substrate processing machine includes a base and a module, disposed on the base, and has a device configured to perform a predetermined operation contributing to the production of a substrate. The module can be switched between a fabrication position where the substrate is produced and an offset position that deviates from the production position relative to the base. The device can operate in the production position and the offset position. The operation speed of the device in the offset position is slower than the operation speed of the device to in the production position.
Public/Granted literature
- US20200029480A1 SUBSTRATE PROCESSING MACHINE Public/Granted day:2020-01-23
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