Invention Grant
- Patent Title: Micro resonator array sensor for detecting wafer processing parameters
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Application No.: US16283364Application Date: 2019-02-22
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Publication No.: US11346875B2Publication Date: 2022-05-31
- Inventor: Chuang-Chia Lin , Upendra Ummethala
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G01R29/08
- IPC: G01R29/08 ; H01L21/66 ; H01Q1/38

Abstract:
Embodiments include systems and methods for determining a processing parameter of a processing operation. Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.
Public/Granted literature
- US20190265286A1 MICRO RESONATOR ARRAY SENSOR FOR DETECTING WAFER PROCESSING PARAMETERS Public/Granted day:2019-08-29
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