Invention Grant
- Patent Title: Coil component
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Application No.: US16029321Application Date: 2018-07-06
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Publication No.: US11348723B2Publication Date: 2022-05-31
- Inventor: Sung Min Moon , Cheol Soon Kim , Yu Jong Kim , Dong Min Kim , Young Do Choi , Tae Ryung Hu
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0169388 20171211
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32 ; H01F27/28 ; H01F17/00 ; H01F17/04

Abstract:
A coil component includes: a body including a support member including a through-hole, a first insulating layer supported by the support member and including a first opening portion, a second insulating layer disposed on the first insulating layer and including a second opening portion, and a coil including a coil pattern filled in the first and second opening portions; and external electrodes disposed on an outer surface of the body.
Public/Granted literature
- US20190180927A1 COIL COMPONENT Public/Granted day:2019-06-13
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