Invention Grant
- Patent Title: Laser transfer apparatus and transfer method using i he same
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Application No.: US16929311Application Date: 2020-07-15
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Publication No.: US11348821B2Publication Date: 2022-05-31
- Inventor: Doyoung Kwag , Byungchul Kim , Sangmoo Park , Minsub Oh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2019-0103482 20190823
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B23K26/03 ; B23K26/04 ; B23K26/08 ; H01L21/67 ; H01L25/075 ; H01L27/12 ; H01L33/62

Abstract:
The application is related to a laser transfer apparatus and a method performed by the laser transfer apparatus. The laser transfer apparatus may include: a laser oscillator configured to perform irradiation with a laser beam; a first stage movably disposed below the laser oscillator; a second stage movably disposed below the first stage; a flatness measurement sensor; and a controller. The controller may be configured to control, once a transfer substrate on which a plurality of light emitting diodes (LEDs) are arranged is loaded on the first stage, and a target substrate is loaded on the second stage, the flatness measurement sensor to measure flatness of each of the transfer substrate and the target substrate, and adjust a height of at least one of the first stage or the second stage based on the flatness.
Public/Granted literature
- US20210057258A1 LASER TRANSFER APPARATUS AND TRANSFER METHOD USING THE SAME Public/Granted day:2021-02-25
Information query
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