Invention Grant
- Patent Title: Semiconductor structure with nanostructure and method for manufacturing the same
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Application No.: US16924546Application Date: 2020-07-09
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Publication No.: US11348836B2Publication Date: 2022-05-31
- Inventor: Pei-Hsun Wang , Chun-Hsiung Lin , Chih-Hao Wang , Chih-Chao Chou
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/8234 ; H01L29/16 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L27/088 ; H01L21/308

Abstract:
Semiconductor structures and methods for forming the same are provided. The method includes forming a fin protruding from a substrate and forming an isolation structure surrounding the fin. The method also includes epitaxially growing channel fins on sidewalls of the fin over the isolation structure and etching the fin to form a space between the channel fins. The method further includes forming a gate structure to fill the space between the channel fins.
Public/Granted literature
- US20200343140A1 SEMICONDUCTOR STRUCTURE WITH NANOSTRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-10-29
Information query
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