A semiconductor package structure includes a package substrate, an encapsulant, at least one passage and at least one semiconductor element. The encapsulant is disposed on the package substrate and has a peripheral surface, and includes a first encapsulant portion and a second encapsulant portion spaced apart from the first encapsulant portion. The at least one passage is defined by the first encapsulant portion and the second encapsulant portion, and the passage has at least one opening in the peripheral surface of the encapsulant. The at least one semiconductor element is disposed on the package substrate and exposed in the passage.