Invention Grant
- Patent Title: Manufacturing method for array substrate and array substrate
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Application No.: US16331288Application Date: 2018-05-22
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Publication No.: US11348947B2Publication Date: 2022-05-31
- Inventor: En-tsung Cho , Yiqun Tian
- Applicant: HKC Corporation Limited , CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Guangdong; CN Chongqing
- Assignee: HKC Corporation Limited,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: HKC Corporation Limited,CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Guangdong; CN Chongqing
- Agency: Rosenberg, Klein & Lee
- Priority: CN201810195542.7 20180309
- International Application: PCT/CN2018/087772 WO 20180522
- International Announcement: WO2019/169740 WO 20190912
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/45 ; H01L29/786 ; H01L29/66

Abstract:
The present disclosure discloses a manufacturing method for an array substrate and an array substrate. The method includes: forming a gate electrode, a gate insulating layer, a semiconductor layer, a source drain electrode layer and a photoresist layer on a substrate; patterning the photoresist layer to form a patterned photoresist layer; performing at least one wet etching on the source drain electrode layer and performing at least one dry etching on the semiconductor layer; performing an ashing processing between the steps of the wet etching and the dry etching. A ratio of a lateral etching rate to a longitudinal etching rate in the at least one ashing processing ranges from 1:0.9 to 1:1.5.
Public/Granted literature
- US20210327913A1 MANUFACTURING METHOD FOR ARRAY SUBSTRATE AND ARRAY SUBSTRATE Public/Granted day:2021-10-21
Information query
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