- Patent Title: Automotive radar sensor packaging methods and related assemblies
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Application No.: US16869507Application Date: 2020-05-07
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Publication No.: US11349203B2Publication Date: 2022-05-31
- Inventor: Majid Ahmadloo , Robert J. Sletten
- Applicant: VEONEER US, INC.
- Applicant Address: US MI Southfield
- Assignee: VEONEER US, INC.
- Current Assignee: VEONEER US, INC.
- Current Assignee Address: US MI Southfield
- Agency: Thayne and Davis LLC
- Agent Matthew D. Thayne
- Main IPC: H01Q1/32
- IPC: H01Q1/32 ; H01L23/66 ; H01L23/552 ; H01L25/18 ; H01L23/367 ; G01S7/02 ; H01Q1/42 ; H01Q13/10 ; G01S13/931

Abstract:
RADAR or other sensor assemblies/modules, particularly those for vehicles, along with related manufacturing/assembly methods. In some embodiments, the assembly may comprise a housing and a printed circuit board. The printed circuit board may comprise a first side and a second side opposite the first side and may further comprise one or more integrated circuits positioned on the first side of the printed circuit board. One or more antennas may be operably coupled with the integrated circuit. A flexible radome, such as a thermoplastic wrapper, may enclose the assembly and may provide the means for binding the printed circuit board to the housing.
Public/Granted literature
- US20210351499A1 AUTOMOTIVE RADAR SENSOR PACKAGING METHODS AND RELATED ASSEMBLIES Public/Granted day:2021-11-11
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