Invention Grant
- Patent Title: Connector
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Application No.: US17491565Application Date: 2021-10-01
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Publication No.: US11349232B2Publication Date: 2022-05-31
- Inventor: Junji Oosaka , Yuichi Takenaga , Akihiro Matsunaga
- Applicant: Japan Aviation Electronics Industry, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee: Japan Aviation Electronics Industry, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JPJP2020-058406 20200327
- Main IPC: H01R12/58
- IPC: H01R12/58 ; H01R12/71 ; H05K1/14 ; H01R13/15 ; H01R13/24 ; G06F1/18

Abstract:
A connector includes a flat-plate housing made of insulating resin and a contact held on a housing by press-fitting. The housing includes a press-fitting space and a solder connection checking hole. The contact includes a press-fit part to be press-fit into the press-fitting space, and a soldering part that extends from the press-fit part and is connected by soldering to a pad of an input-output board. The solder connection checking hole is formed to penetrate the housing in the vertical direction and allow a solder fillet, which is formed when the soldering part is soldered to the pad of the input-output board, to be checked through the solder connection checking hole. The housing includes a separating wall that separates the press-fitting space from the solder connection checking hole.
Public/Granted literature
- US20220021140A1 CONNECTOR Public/Granted day:2022-01-20
Information query
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