Invention Grant
- Patent Title: Copper alloy powder having excellent laser absorptivity
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Application No.: US16975355Application Date: 2019-03-01
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Publication No.: US11351601B2Publication Date: 2022-06-07
- Inventor: Jun Kato , Yuki Ito , Hiroyuki Matsukawa
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP
- Priority: JPJP2018-036502 20180301
- International Application: PCT/JP2019/008150 WO 20190301
- International Announcement: WO2019/168166 WO 20190906
- Main IPC: C22C9/10
- IPC: C22C9/10 ; B33Y70/00 ; B22F1/05

Abstract:
This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 μm to 80 μm. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.
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