Invention Grant
- Patent Title: Laser processing apparatus with calculating section
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Application No.: US16910655Application Date: 2020-06-24
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Publication No.: US11351631B2Publication Date: 2022-06-07
- Inventor: Atsushi Ueki , Yutaka Kobayashi
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain Ltd.
- Priority: JPJP2019-127514 20190709
- Main IPC: B23K26/08
- IPC: B23K26/08 ; B23K26/06 ; B23K26/364 ; B23K26/50 ; H01L21/67 ; H01L21/683 ; H01L21/78 ; B23K103/00 ; H01L21/268

Abstract:
A calculating section of a control unit calculates a vertical position Defocus for a condensing lens using a height value H1 of a modified layer in a wafer that is set by a setting section according to the equation (1) below. Defocus=(thickness T1 of wafer−height value H1−b)/a (1) The calculating section calculates an appropriate vertical position for the condensing lens according to the equation (1) depending on the height value H1 of the modified layer that is set by the setting section. Therefore, the vertical position of the condensing lens in laser processing operation can be determined more easily, and a time-consuming and tedious experiment for fine adjustment of the vertical position of the condensing lens does not need to be conducted.
Public/Granted literature
- US20210008661A1 LASER PROCESSING APPARATUS Public/Granted day:2021-01-14
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