Invention Grant
- Patent Title: Die with a modular adjustment system and a modular adjustment system
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Application No.: US16122591Application Date: 2018-09-05
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Publication No.: US11351711B2Publication Date: 2022-06-07
- Inventor: Dale Pitsch , Mike Dudley , Kerry Reetz
- Applicant: NORDSON CORPORATION
- Applicant Address: US OH Westlake
- Assignee: NORDSON CORPORATION
- Current Assignee: NORDSON CORPORATION
- Current Assignee Address: US OH Westlake
- Agency: BakerHostetler
- Main IPC: B29C48/25
- IPC: B29C48/25 ; B29C48/30 ; B29C48/31 ; B29C48/08

Abstract:
An adjustment system coupled to a die, and a die including an adjustment system, includes first and second adjustment modules. The first adjustment module includes a first body, a first plurality of studs, and a first actuator. Each of the first plurality of studs is slidably positioned within the first body. The first actuator is coupled to the first plurality of studs and is configured to move each of the first plurality of studs. The second adjustment module includes a second body, a second plurality of studs, and a second actuator. Each of the second plurality of studs is slidably positioned within the second body. The second actuator is coupled to the second plurality of studs and is configured to move each of the second plurality of studs. The number of studs composing the first plurality of studs is different from a number of studs composing the second plurality of studs.
Public/Granted literature
- US20190091913A1 DIE WITH A MODULAR ADJUSTMENT SYSTEM AND A MODULAR ADJUSTMENT SYSTEM Public/Granted day:2019-03-28
Information query