Invention Grant
- Patent Title: Three-dimensional shaping device and three-dimensional shaped object manufacturing method
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Application No.: US16910276Application Date: 2020-06-24
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Publication No.: US11351731B2Publication Date: 2022-06-07
- Inventor: Kohei Yuwaki , Masayuki Gozu , Koichi Saito
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2019-116844 20190625
- Main IPC: B29C64/35
- IPC: B29C64/35 ; B29C64/321 ; B29C64/232 ; B29C64/245 ; B29C64/295 ; B29C64/209 ; B29C64/393 ; B29C64/236 ; B29C64/25 ; B33Y10/00 ; B33Y30/00 ; B33Y50/02

Abstract:
A three-dimensional shaping device includes a nozzle that discharges a shaping material, a stage that includes a stacking surface on which the shaping material is stacked, a moving mechanism that changes a relative position between the nozzle and the stage, a distance measurement mechanism that is disposed at a position facing the nozzle, a cleaning mechanism that cleans a tip end surface of the nozzle, and a control unit that controls the moving mechanism while discharging the shaping material from the nozzle towards the stacking surface so as to shape a three-dimensional shaped object. The control unit measures a first value relating to a distance between the tip end surface of the nozzle and the stacking surface after the tip end surface of the nozzle is cleaned, and controls the moving mechanism based on the first value to adjust the distance between the stacking surface and the tip end surface of the nozzle to a predetermined distance to shape the three-dimensional shaped object.
Information query