Invention Grant
- Patent Title: Liquid ejection head
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Application No.: US16887240Application Date: 2020-05-29
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Publication No.: US11351783B2Publication Date: 2022-06-07
- Inventor: Hideki Hayashi
- Applicant: Brother Kogyo Kabushiki Kaisha
- Applicant Address: JP Nagoya
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Nagoya
- Agency: Banner & Witcoff, Ltd.
- Priority: JPJP2019-106012 20190606
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejection head includes a flow channel structure, a supply channel structure, a piezoelectric element, a sealing substrate, and a heater. The flow channel structure defines an ejection channel including an individual channel and a manifold. The individual channel has a nozzle and a pressure chamber in which pressure is applied to liquid for causing the liquid to be ejected from the nozzle. The supply channel structure defines a supply channel configured to allow the liquid to flow therethrough to the ejection channel. The piezoelectric element is positioned on an upper surface of the flow channel structure and facing the pressure chamber via a vibration plate. The sealing substrate is made of a material having a higher thermal conductivity than the supply channel structure. The sealing substrate surrounds the piezoelectric element on the flow channel structure to seal the piezoelectric element. The heater is disposed at the sealing substrate.
Information query
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