Invention Grant
- Patent Title: Curved fluid ejection devices
-
Application No.: US17276971Application Date: 2018-11-21
-
Publication No.: US11351787B2Publication Date: 2022-06-07
- Inventor: Chien-Hua Chen , Michael W. Cumbie , Si-Iam J. Choy
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Fabian VanCott
- International Application: PCT/US2018/062302 WO 20181121
- International Announcement: WO2020/106295 WO 20200528
- Main IPC: B41J2/16
- IPC: B41J2/16 ; B41J2/14 ; B29C53/04 ; B29C35/02 ; B29L31/00

Abstract:
A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
Public/Granted literature
- US20220032626A1 CURVED FLUID EJECTION DEVICES Public/Granted day:2022-02-03
Information query
IPC分类: