Invention Grant
- Patent Title: Logic circuitry package
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Application No.: US16768651Application Date: 2019-12-03
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Publication No.: US11351791B2Publication Date: 2022-06-07
- Inventor: James Michael Gardner , James William Ring , David Owen Roethig , Christopher Hans Bakker
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2019/064213 WO 20191203
- International Announcement: WO2020/117786 WO 20200611
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/045 ; G06F13/42 ; G06F21/44 ; G06F1/12 ; G06F1/08 ; H03K19/0175 ; B33Y30/00 ; B29C64/259 ; G06F3/12 ; G01F23/24 ; G01F23/80

Abstract:
A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit. The logic circuit is configured to receive, via the interface, a plurality of first requests in a heater disabled mode, each first request corresponding to a different sensor ID of a plurality of sensor IDs; transmit, via the interface, a first digital value in response to each first request; receive, via the interface, a plurality of second requests in a heater enabled mode, each second request corresponding to a different sensor ID of the plurality of sensor IDs; and transmit, via the interface, a second digital value in response to each second request. Delta values corresponding to a difference between the first digital value and the second digital value for each different sensor ID of the plurality of sensor IDs are indicative of a print material level.
Public/Granted literature
- US20210237435A1 LOGIC CIRCUITRY PACKAGE Public/Granted day:2021-08-05
Information query
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